This product has been requested through homepage. Surface of bonding-target is flat by 0.05.
| Material | Copper |
|---|---|
| Size | Thickness 15 x Outer Diameter φ370 |
| Industry | Semiconductor |
| Processing details | Machinig-center,Lathe ,FSW |
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- Product Examples: Sputtering Backing Plates
- Sputtering Copper Backing Plate (Circular type)